Molded cavity substrate MEMS package fabrication method and structure

摘要

A molded ring includes a molded cavity of a molded cavity substrate MEMS package. The molded ring is formed by molding a dielectric material directly upon a substrate. As molding is a relatively simple and low cost process, the molded ring and thus molded cavity are formed at a minimal cost. This, in turn, minimizes the cost of the molded cavity substrate MEMS package.

主权项

1. An electronic component package comprising:
a Micro Electro Mechanical Systems (MEMS) electronic component; a first substrate; and a molded ring coupled to the first substrate, the molded ring comprising a molded cavity, the MEMS electronic component being located within the molded cavity, wherein:
the first substrate comprises inner terminals; andthe electronic component package further comprising electrically conductive through vias coupled to the inner terminals and extending through the molded ring.