发明名称 |
BINDER COMPOSITION FOR MOLDING SELF-CURING MOLD |
摘要 |
<p>PROBLEM TO BE SOLVED: To provide a binder composition for molding a self-curing mold: where formaldehyde odor can be reduced without regulating pH when molding a mold while keeping excellent storage stability; and further the strength of the obtained mold can be kept and to provide a composition for the mold using the same.SOLUTION: A binder composition for molding a self-curing mold: contains at least one selected from among a furan resin, urea, an alkylene urea and an alkyl urea; has a urea content of 0.8 mass% or more and 2.0 mass% or less; and has a pH value of 6.0 or less at 25°C.</p> |
申请公布号 |
JP2015089553(A) |
申请公布日期 |
2015.05.11 |
申请号 |
JP20130229216 |
申请日期 |
2013.11.05 |
申请人 |
KAO CORP |
发明人 |
IWAMOTO RYOJI;YAMAGUCHI DAISUKE |
分类号 |
B22C1/22;C08K5/21;C08L61/00 |
主分类号 |
B22C1/22 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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