发明名称 BINDER COMPOSITION FOR MOLDING SELF-CURING MOLD
摘要 <p>PROBLEM TO BE SOLVED: To provide a binder composition for molding a self-curing mold: where formaldehyde odor can be reduced without regulating pH when molding a mold while keeping excellent storage stability; and further the strength of the obtained mold can be kept and to provide a composition for the mold using the same.SOLUTION: A binder composition for molding a self-curing mold: contains at least one selected from among a furan resin, urea, an alkylene urea and an alkyl urea; has a urea content of 0.8 mass% or more and 2.0 mass% or less; and has a pH value of 6.0 or less at 25°C.</p>
申请公布号 JP2015089553(A) 申请公布日期 2015.05.11
申请号 JP20130229216 申请日期 2013.11.05
申请人 KAO CORP 发明人 IWAMOTO RYOJI;YAMAGUCHI DAISUKE
分类号 B22C1/22;C08K5/21;C08L61/00 主分类号 B22C1/22
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