PACKAGED ELECTRONIC DEVICE, METHOD FOR PRODUCING PACKAGED RADIO FREQUENCY (RF) MODULE, AND WIRELESS DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a method relating to packaging of a radio frequency (RF) device on a device and a ceramic substrate.SOLUTION: A packaged electronic device may include the ceramic substrate configured to support one or more components. The ceramic substrate may include a conductive layer in electrical contact with a ground plane. The packaged electronic device may further include a die that includes an integrated circuit and is mounted on a surface of the ceramic substrate. The packaged electronic device may further include conformal conductive coating that is implemented on the die and gives a shield functionality. The packaged electronic device may further include an electrical connection part between the conformal conductive coating and the conductive layer.