| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a semiconductor pressure sensor device equipped with a structure capable of preventing an adhesive from being stuck to an electronic component, in a structure fixing a frame component onto a circuit substrate with the adhesive.SOLUTION: A circuit substrate 20 has a step 25 in which an area corresponding to a first opening end 52 of a sleeve 50 of one surface 21 projects from the one surface 21 in a direction perpendicular to the one surface 21 and on which the first opening end 52 of the sleeve 50 is fixed via an adhesive 70. The step 25 has an offset area 26 projecting from an inner wall surface 56 configuring a hollow portion 51 of the sleeve 50, in a surface direction parallel to the one surface 21. Furthermore, the inner wall surface 56 of the sleeve 50 is formed in a tapered shape such that opening size of the first opening end 52 side of the sleeve 50 becomes smaller than opening size of a second opening end 54 side on the opposite side to the first opening end 52.</p> |
