发明名称 WIRING SUBSTRATE
摘要 A wiring substrate (A) includes an insulating substrate (1) and a wiring conductor (2) attached to the upper and the lower side of the insulating substrate (1). The wiring conductor (2) includes a different tracks (6) consisting of two band-shaped conductors which are attached to the upper side of the insulating substrate (1) and are arranged in parallel. The insulating substrate (1) comprises a glass cloth (6) which is vertically woven with a bundle of glass fiber and has a gap in it and a recess on a surface, and a flat insulating resin part (5) which is filled in the gap and the recess and is formed on the upper and the lower surface of the glass cloth (4). A difference between the relative permittivity of the glass cloth (4) and the relative permittivity of the insulating resin part (5) is 0.5 or less.
申请公布号 KR20150050453(A) 申请公布日期 2015.05.08
申请号 KR20140148240 申请日期 2014.10.29
申请人 KYOCERA SLC TECHNOLOGIES CORPORATION 发明人 NAKAMURA SATOSHI
分类号 H01L23/12;H05K3/46 主分类号 H01L23/12
代理机构 代理人
主权项
地址