发明名称 HEAT INSULATION SHEET AND THERMAL INSULATION STRUCTURE USING THE SAME
摘要 <p>PROBLEM TO BE SOLVED: To provide a heat insulation sheet capable of preventing temperature on a housing surface from locally rising by suppressing an increase in a temperature on a heating component.SOLUTION: The heat insulation sheet includes: a graphite sheet 15; and a low heat conductive sheet 16 which is stuck on the graphite sheet 15, the coefficient of thermal conductivity of which is 0.1- 0.3 W/mK; and thickness of which is 0.2-1 mm. The low heat conductive sheet 16 on the heat insulation sheet 14 is stuck on an inner wall of the housing 13, and the graphite sheet 15 is thermally coupled with a heating component 11.</p>
申请公布号 JP2015088575(A) 申请公布日期 2015.05.07
申请号 JP20130224939 申请日期 2013.10.30
申请人 PANASONIC IP MANAGEMENT CORP 发明人 KUMANO YUTAKA;HIRUMA TAKAYUKI
分类号 H05K7/20;G06F1/20;H01L23/36 主分类号 H05K7/20
代理机构 代理人
主权项
地址