发明名称 PLATE TYPE COOLING APPARATUS
摘要 A plate type cooling apparatus is disclosed. The plate type cooling apparatus in accordance with an embodiment of the present invention includes: a first elastic plate made of an elastic material; a second elastic plate made of an elastic material and having one end thereof joined with the first elastic plate and the other end thereof separated from the first elastic plate; a piezoelectric element coupled with at least one of the first elastic plate and the second elastic plate and being deformable by applied electric power; and a power source coupled with the piezoelectric element so as to apply electric power to the piezoelectric element.
申请公布号 US2015125320(A1) 申请公布日期 2015.05.07
申请号 US201414228230 申请日期 2014.03.27
申请人 SAMSUNG ELECTRO-MECHANICS CO., LTD. 发明人 JUN Jae-Woo
分类号 F04B43/04 主分类号 F04B43/04
代理机构 代理人
主权项 1. A plate type cooling apparatus, comprising: a first elastic plate made of an elastic material; a second elastic plate made of an elastic material and having one end thereof joined with the first elastic plate and the other end thereof separated from the first elastic plate; a piezoelectric element coupled with at least one of the first elastic plate and the second elastic plate and being deformable by applied electric power; and a power source coupled with the piezoelectric element so as to apply electric power to the piezoelectric element.
地址 Suwon-si KR
您可能感兴趣的专利