| 摘要 |
<p>The invention provides a reflow soldering device which can reduce electric power consumption and can set expected temperature profiles by supplying the medium becoming hot after being used in the cooling into an oven. The reflow soldering oven is continuously provided with a plurality of oven bodies along the conveying path of the object to be heated, and at least part of the oven is covered by heat insulation materials. A reheating part, a reflow soldering part, and a cooling part are successively formed from the inlet side of the conveying path toward the outlet side of the conveying path. The medium after being used in the cooling, such as nitrogen, is supplied to the oven bodies in the reflow soldering part. A piping is arranged in the area of the preheating part adjacent to the reflow soldering part, and the medium is supplied into the piping to cool the area.</p> |
