发明名称 CONVEYANCE DEVICE AND SUBSTRATE PROCESSING SYSTEM
摘要 A conveyance device, which conveys wafers in a casing 30, includes a primary blowing fan 17 that generates airflow within the casing 30 in a first direction; a discharge opening 26 that is located at a downstream side of the airflow generated by the primary blowing fan 17, is interconnected with the interior of the casing 30, and discharges gases at the interior of the casing 30 outside of the casing 30; a base 18d that is supported by a gate-shaped conveyance arm 22 disposed within the casing 30 and moves within the casing 30 at the upstream side of the discharge opening 26 and at the downstream side of the primary blowing fan 17; an end effector 21 that is located at the base 18d and that carries wafers; and a blowing fan 19 that is located at the base and that generates airflow in the first direction.
申请公布号 US2015125238(A1) 申请公布日期 2015.05.07
申请号 US201214361869 申请日期 2012.11.28
申请人 TOKYO ELECTRON LIMITED 发明人 Hiroki Tsutomu;Sawada Ikuo;Matsuzaki Kazuyoshi;Fukuhara Yoshiki
分类号 H01L21/677;H01L21/67 主分类号 H01L21/677
代理机构 代理人
主权项
地址 Tokyo JP