发明名称 METHOD FOR CUTTING SEMICONDUCTOR SUBSTRATE
摘要 <p>PURPOSE:To prevent cut chips remaining in cut grooves from flying and sticking to the surface of a chip at the time of hip-up of the chip by ejecting high pressure water to the cut grooves for cleaning, independent of cooling, cutting water for a high speed rotary grindstone. CONSTITUTION:When a substrate 2 fixed on a chuck table 1 is cut by a rotary grinstone 4, cutting water for removing cut chips from a cover portion 3 is ejected from an ejecting port 5 in the forwarding direction of the rotary grindstone 4, an ejecting port 6 in the vertical direction and an ejecting port 7 in the direction of the substrate. In addition thereto, high pressure water is ejected to cut grooves after cutting from an ejecting port 8 for cleaning the cut grooves. The flow quantity and the pressure of the water ejected from the cut groove cleaning ejecting port 8 is determined by taking account of the dimensions of the rotary grindstone 4 and its rotational number cutting speed.</p>
申请公布号 JPH03149183(A) 申请公布日期 1991.06.25
申请号 JP19890286265 申请日期 1989.11.02
申请人 NEC YAMAGUCHI LTD 发明人 AKIMOTO YOSHIYUKI
分类号 B24B55/02;H01L21/301;H01L21/78 主分类号 B24B55/02
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