THERMOSETTING RESIN COMPOSITION AND USES THEREOF

摘要

The present invention relates to a thermosetting resin composition. The composition comprises: 20% to 70% wt% of thermosetting resin, 1% to 30% wt% of a curing agent, and 0% to 10% wt% of an accelerant, a tungsten compound and an inorganic filler. A prepreg can be prepared in an impregnation manner or a coating product can be prepared in a coating manner. The composition can obviously decrease a thermal expansion coefficient of a laminated board and can effectively block UV light and decrease the light transmissivity.