RESIN COMPOSITION, PREPREG, METAL-CLAD LAMINATE, AND PRINTED WIRING BOARD

摘要

PROBLEM TO BE SOLVED: To provide a resin composition which is excellent in heat resistance and flame retardancy of a cured product while maintaining excellent dielectric characteristics of a polyphenylene ether, and to provide a prepreg using the resin composition, a metal-clad laminate using the prepreg, and a printed wiring board using the metal-clad laminate.SOLUTION: The resin composition is used which contains a modified polyphenylene ether compound terminal-modified with a substituent having a carbon-carbon unsaturated double bond, a crosslinking type curing agent having a carbon-carbon unsaturated double bond in the molecule, and a flame retardant. The flame retardant contains a compatible phosphorus compound compatible with a mixture of the modified polyphenylene ether compound and the crosslinking type curing agent, and an incompatible phosphorus compound incompatible with the mixture.