Electronic Device and Method of Fabricating an Electronic Device

摘要

An electronic device may comprise a semiconductor element and a wire bond connecting the semiconductor element to a substrate. Using a woven bonding wire may improve the mechanical and electrical properties of the wire bond. Furthermore, there may be a cost benefit. Woven bonding wires may be used in any electronic device, for example in power devices or integrated logic devices.

主权项

1. An electronic device comprising:
a first substrate and a second substrate; and an electrical connection connecting the first and second substrate; wherein the electrical connection comprises a woven bonding wire.