| 摘要 |
The purpose of the present invention is to improve cooling capability of a semiconductor module that uses pin connections. In this semiconductor module, a first semiconductor element (1) and a second semiconductor element (13) are respectively connected to pins (10 and 14), and this semiconductor module is provided with: a first pin wiring board (5) which is provided with a second metal foil (5c) and first metal foil (5b) which bond with the pins (10) on the upper and lower surface thereof; ; a first DCB substrate (2) which is provided with a third metal foil (2b) and fourth metal foil (2c) on the upper and lower surfaces thereof, and in which the third metal foil (2b) is bonded with the lower surface of the first semiconductor element (1); a second pin wiring board (15) which is provided with a seventh metal foil (15b) and eighth metal foil (15c) which bond with the pins (14) on the upper and lower surfaces thereof; a second DCB substrate (4) which is provided with a fifth metal foil (4b) on the lower surface thereof and a sixth metal foil (4c) on the upper surface thereof, and in which the fifth metal foil (4b) is bonded with the upper surface of the second semiconductor element (13); a connecting member (12) for which both ends are connected to the second metal foil (5c) and the fifth metal foil (4b); a first cooler (6) which is connected to the fourth metal foil (2c); and a second cooler (7) which is connected to the sixth metal foil (4c). |
