| 摘要 |
PROBLEM TO BE SOLVED: To improve the reliability of mounting bonding between a package for an electronic component and a circuit board.SOLUTION: In a base 1 of a package holding an electronic component element, a base bottom surface is rectangular when viewed in plane, at least a pair of terminal electrodes 12a, 12b to be joined using an external circuit board and a conductive joint member are formed. In the terminal electrodes, thinned areas 127a, 127b where only the terminal electrode is formed, thickened areas 128a, 128b where smaller bumps 16a, 16b than the terminal electrode are formed on the terminal electrodes, and electrodeless areas 122a, 122b inside areas of the terminal electrodes are formed. On the straight line toward the center point of the base bottom surface from an angle of the base bottom surface, at least a part of the thinned areas, a part of the electrodeless areas, and a part of the thickened areas are arranged. |
