METHOD OF MANUFACTURING CIRCUIT BOARD, METHOD OF MANUFACTURING ELECTRONIC DEVICE, AND ELECTRONIC DEVICE

摘要

A method of manufacturing a circuit board includes forming a first electrode on a support substrate, covering the support substrate and the first electrode with a first insulating layer, polishing the first insulating layer to expose a first surface of the first electrode, forming a first wiring on the first insulating layer after exposing the first surface of the first electrode, the first wiring being connected to the first electrode, and removing the support substrate to expose a second surface of the first electrode after forming the first wiring.

主权项

1. An electronic device, comprising:
a circuit board including a first insulating layer, a first wiring provided on a first surface of the first insulating layer, a second insulating layer provided on the first surface of the first insulating layer to cover the first wiring, and a first electrode provided in the first insulating layer and including a first end connected to the first wiring and a second end exposed from a second surface of the first insulating layer; and an electronic device including a terminal connected to the second end of the first electrode by soldering.