发明名称 |
CORE SUBSTRATE AND METHOD FOR MANUFACTURING CORE SUBSTRATE |
摘要 |
PROBLEM TO BE SOLVED: To provide a core substrate and a method for manufacturing the core substrate which are capable of reducing occurrence of deformation, cracks, damage and the like while improving adhesion between the core substrate and electronic devices.SOLUTION: A core substrate 100 includes: a porous scaffold 130 formed with a void 131; an insulating material 140 formed to fill the void 131 of the porous scaffold 130; and an electronic device 110 embedded into the porous scaffold 130 and the insulating material 140 and having external electrodes 111 formed on both surfaces thereof. |
申请公布号 |
JP2015088750(A) |
申请公布日期 |
2015.05.07 |
申请号 |
JP20140216214 |
申请日期 |
2014.10.23 |
申请人 |
SAMSUNG ELECTRO-MECHANICS CO LTD |
发明人 |
HONG JIN HO;LEE KEUN YONG;KIM SUNG HAN;LEE SA YONG;SHIN SUNG HYUN |
分类号 |
H05K1/18;H01G2/06 |
主分类号 |
H05K1/18 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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