发明名称 CORE SUBSTRATE AND METHOD FOR MANUFACTURING CORE SUBSTRATE
摘要 PROBLEM TO BE SOLVED: To provide a core substrate and a method for manufacturing the core substrate which are capable of reducing occurrence of deformation, cracks, damage and the like while improving adhesion between the core substrate and electronic devices.SOLUTION: A core substrate 100 includes: a porous scaffold 130 formed with a void 131; an insulating material 140 formed to fill the void 131 of the porous scaffold 130; and an electronic device 110 embedded into the porous scaffold 130 and the insulating material 140 and having external electrodes 111 formed on both surfaces thereof.
申请公布号 JP2015088750(A) 申请公布日期 2015.05.07
申请号 JP20140216214 申请日期 2014.10.23
申请人 SAMSUNG ELECTRO-MECHANICS CO LTD 发明人 HONG JIN HO;LEE KEUN YONG;KIM SUNG HAN;LEE SA YONG;SHIN SUNG HYUN
分类号 H05K1/18;H01G2/06 主分类号 H05K1/18
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