High thermal conductivity dielectric materials systems or pastes are useful on aluminum alloy substrates for LED and high power circuitry applications.
申请公布号
WO2015065654(A1)
申请公布日期
2015.05.07
申请号
WO2014US59219
申请日期
2014.10.06
申请人
FERRO CORPORATION
发明人
SRIDHARAN, SRINIVASAN;BROWN, ORVILLE, W.;GRADDY, GEORGE, E.