发明名称 COPPER ALLOY SHEET EXCELLENT IN CONDUCTIVITY, STRESS RELAXATION RESISTANCE AND MOLDABILITY
摘要 <p>PROBLEM TO BE SOLVED: To provide a copper alloy sheet having high strength, high conductivity and excellent stress relaxation property and an electronic component for large current and an electronic component for heat release using the copper alloy sheet.SOLUTION: There is provided a copper alloy sheet containing one or more kind of Ni and Co of 0.8 to 5.0 mass% as total, Si of 0.2 to 1.5 mass% and the balance copper with inevitable impurities, having 500 MPa or more of 0.2% yield stress and 30%IACS or more of conductivity, and thermal shrinkage rate in a rolling direction when heated for 30 minutes at 250°C of 50 ppm or less.</p>
申请公布号 JP2015086416(A) 申请公布日期 2015.05.07
申请号 JP20130224385 申请日期 2013.10.29
申请人 JX NIPPON MINING & METALS CORP 发明人 HATANO TAKAAKI
分类号 C22C9/06;C22C9/00;C22C9/01;C22C9/02;C22C9/04;C22C9/05;C22C9/10;H01B1/02;H01B5/02 主分类号 C22C9/06
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