发明名称 PLATING BATH AND METHOD
摘要 Tin-containing electroplating baths having a combination of certain brightening agents provide tin-containing solder deposits having reduced void formation and smooth morphology.
申请公布号 US2015122661(A1) 申请公布日期 2015.05.07
申请号 US201314071677 申请日期 2013.11.05
申请人 Rohm and Haas Electronic Materials LLC 发明人 WOERTINK Julia;QIN Yi;PRANGE Jonathan D.;LOPEZ MONTESINOS Pedro O.
分类号 C25D3/32;C25D7/12 主分类号 C25D3/32
代理机构 代理人
主权项 1. An electroplating composition comprising: a source of tin ions; an acid electrolyte; 0.0001 to 0.045 g/L of a first grain refiner; 0.005 to 0.75 g/L of an α,β-unsaturated aliphatic carbonyl compound as a second grain refiner; a nonionic surfactant; and water; wherein the first grain refiner is chosen from a compound of formula (1) or (2)wherein each R1 is independently (C1-6)alkyl, (C1-6)alkoxy, hydroxy, or halo; R2 and R3 are independently chosen from H and (C1-6)alkyl; R4 is H, OH, (C1-6)alkyl or O(C1-6)alkyl; m is an integer from 0 to 2; each R5 is independently (C1-6)alkyl; each R6 is independently chosen from H, OH, (C1-6)alkyl, or O(C1-6)alkyl; n is 1 or 2; and p is 0, 1 or 2.
地址 Marlborough MA US