发明名称 |
THIN FILM COIL, CASE ASSEMBLY, NON-CONTACT POWER RECEIVING DEVICE, AND ELECTRONIC DEVICE HAVING THE SAME |
摘要 |
The present invention relates to a thin film coil, a case assembly, a non-contact power receiving device and an electronic device including the same. The thin film coil according to an embodiment of the present invention is a thin film coil disposed at a non-contact power transmitting device for transmitting power wirelessly or a non-contact power receiving device for receiving the power transmitted from the non-contact power transmitting device. The thin film coil comprises: a flexible substrate; a first coil strip formed on one surface of the flexible substrate and including a spiral pattern and a withdrawal pattern withdrawing from one end, which has been arranged in the spiral pattern, to the outside of the spiral pattern; a second coil strip formed on the other surface of the flexible substrate; and a plurality of vias for detour penetrating the flexible substrate at a position adjacent to the withdrawal pattern and connecting the first coil strip and the second coil strip. |
申请公布号 |
KR20150048695(A) |
申请公布日期 |
2015.05.07 |
申请号 |
KR20150054776 |
申请日期 |
2015.04.17 |
申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
LIM, DAE KI;CHANG, KI WON;HAN, CHANG MOK;NAM, HYEON GIL;LEE, HYUN SEOK;CHO, SUNG EUN;SUNG, JAE SUK;KIM, TAE SUNG;AN, CHAN GWANG;BAE, SANG WOO |
分类号 |
H01F5/00;H01F38/14;H02J17/00 |
主分类号 |
H01F5/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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