发明名称 |
SUBSTRATE TREATMENT APPARATUS |
摘要 |
<p>PROBLEM TO BE SOLVED: To provide a substrate treatment apparatus for applying heat treatment to a substrate.SOLUTION: A substrate treatment apparatus comprises: a heat treatment chamber 200 having a heat treatment space for a substrate; a substrate support base 500 to support the substrate in the heat treatment space; and a heating block 100 which comprises heating lamps 300 to generate thermal energy and gas injection ports 400 to inject a gas toward the substrate support base, where the heating lamps and the gas injection ports are placed to face the substrate support base.</p> |
申请公布号 |
JP2015088749(A) |
申请公布日期 |
2015.05.07 |
申请号 |
JP20140211848 |
申请日期 |
2014.10.16 |
申请人 |
AP SYSTEMS INC |
发明人 |
YOUN DOO YOUNG;JI SANG-HYUN;LEE SONG YEON |
分类号 |
H01L21/26;C23C16/46;H01L21/205;H01L21/265;H01L21/28;H01L21/31 |
主分类号 |
H01L21/26 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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