发明名称 SUBSTRATE TREATMENT APPARATUS
摘要 <p>PROBLEM TO BE SOLVED: To provide a substrate treatment apparatus for applying heat treatment to a substrate.SOLUTION: A substrate treatment apparatus comprises: a heat treatment chamber 200 having a heat treatment space for a substrate; a substrate support base 500 to support the substrate in the heat treatment space; and a heating block 100 which comprises heating lamps 300 to generate thermal energy and gas injection ports 400 to inject a gas toward the substrate support base, where the heating lamps and the gas injection ports are placed to face the substrate support base.</p>
申请公布号 JP2015088749(A) 申请公布日期 2015.05.07
申请号 JP20140211848 申请日期 2014.10.16
申请人 AP SYSTEMS INC 发明人 YOUN DOO YOUNG;JI SANG-HYUN;LEE SONG YEON
分类号 H01L21/26;C23C16/46;H01L21/205;H01L21/265;H01L21/28;H01L21/31 主分类号 H01L21/26
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