| 发明名称 |
EMBEDDED LAYERED INDUCTOR |
| 摘要 |
An embedded layered inductor is provided that includes a first inductor layer and a second inductor layer coupled to the first inductor layer. The first inductor layer comprises a patterned metal layer that may also be patterned to form pads. The second inductor layer comprises metal deposited in a dielectric layer adjacent the patterned metal layer. |
| 申请公布号 |
US2015124418(A1) |
申请公布日期 |
2015.05.07 |
| 申请号 |
US201314073756 |
申请日期 |
2013.11.06 |
| 申请人 |
QUALCOMM Incorporated |
发明人 |
Song Young Kyu;Kim Daeik Daniel;Zhang Xiaonan;Lane Ryan David;Kim Jonghae |
| 分类号 |
H05K1/16 |
主分类号 |
H05K1/16 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A substrate, comprising:
a first dielectric layer; a first metal layer adjacent the first dielectric layer, wherein the first metal layer is configured to form a first inductor layer; a second inductor layer, wherein the first inductor layer and the second inductor layer are configured to form a layered inductor that includes sidewalls extending from an opposing surface of the second inductor layer to the first dielectric layer, and a second dielectric layer configured to surround the sidewalls of the layered inductor. |
| 地址 |
San Diego CA US |
