发明名称 非接触電力およびデータ伝送システムならびに方法
摘要 <p>A contactless power and data transfer system is disclosed. The system includes an encapsulated optoelectronic semiconductor device at least partly disposed within a barrier encapsulation, and a contactless power transfer system configured to transfer at least one of power and data across the barrier encapsulation. A method for manufacturing a contactless power and data transfer system is also disclosed.</p>
申请公布号 JP5715419(B2) 申请公布日期 2015.05.07
申请号 JP20100539560 申请日期 2008.11.14
申请人 发明人
分类号 H02J17/00;H01L51/50;H05B33/04;H05B33/08 主分类号 H02J17/00
代理机构 代理人
主权项
地址