| 摘要 |
A method for manufacturing an electronic component having a flexible structure may comprise the steps of: forming an integrated circuit element package having a foldable and expandable flexible structure, the integrated circuit element package comprising a first substrate having a foldable and expandable, flexible structure and having a structure on which a heat transfer part capable of transferring heat is patterned, an integrated circuit element having a foldable and expandable, flexible structure and having a first pad of which one surface is electrically connectable, and an adhesive film having a foldable and expandable, flexible structure, which is disposed between the substrate and the integrated circuit element so that the substrate and the integrated circuit element can be adhered to each other; forming a second substrate having a foldable and expandable, flexible structure and having a second pad of which one surface is electrically connectable; and performing a thermo-compression process so as to adhere the integrated circuit element package to the second substrate while electrically connecting the first pad of the integrated circuit element with the second pad of the second substrate through surface contact, wherein heat is transferred from the first substrate to the second substrate via the heat transfer part when performing the thermo-compression process. |
