The present disclosure is drawn to a piezoelectric thin film stack and method of preparing the same. The piezoelectric thin film stack can comprise a substrate with an oxide application surface, a metal oxide adhesive blend layer applied to the oxide application surface, and a piezoelectric film applied directly to the metal oxide adhesive blend layer.
申请公布号
WO2015065397(A1)
申请公布日期
2015.05.07
申请号
WO2013US67614
申请日期
2013.10.30
申请人
HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.;THE STATE OF OREGON ACTING BY AND THROUGH THE STATE BOARD OF HIGHER EDUCATION ON BEHALF OF OREGON STATE UNIVERSITY
发明人
ABBOTT, JAMES ELMER, JR.;MARDILOVICH, PETER;GIBBONS, BRADY;MAACK, BRYAN ALEXANDER
