| 摘要 |
The present invention reduces time and costs for manufacturing a socket used when transmitting and receiving high-speed signals with a device. Provided are an interface apparatus and a manufacturing method. The interface apparatus which is electrically accessing a device comprises: a first substrate having at least one substrate; a second substrate which has at least one substrate and is stacked on a first side of the first substrate; a first pin connector which is installed inside a through tube penetrating the first and second substrates and electrically accessing between terminals in the device which is mounted on a second side on the opposite side of the first side of the first substrate and the second substrate; and a second pin connector which is installed inside the through tube of the second substrate and electrically accessing between terminal of the device mounted the terminal on the first substrate and terminal of the device mounted on the second substrate. |
