| 摘要 |
A solder alloy of a tin-silver-copper solder alloy, containing tin, silver, antimony, bismuth, copper, and nickel, and substantially does not contain germanium, relative to the total amount of the solder alloy, the silver content is more than 1.0 mass% and less than 1.2 mass%, the antimony content is 0.01 mass% or more and 10 mass% or less, and the bismuth content is 0.01 mass% or more and 3.0 mass% or less. |
