发明名称 |
Semiconductor device |
摘要 |
In a semiconductor device, a first contact-diffusion-layer is in a first well to be connected to the first well and extends in a channel width direction of a first transistor in a first well. A second contact-diffusion-layer is in the first well so as to be electrically connected to the first well and extends in a channel-length direction of the first transistor. A first contact on the first contact-diffusion-layer has a shape with a diameter in the channel-width direction larger than that in the channel-length direction when viewed from above the substrate. A second contact on the second contact-diffusion-layer has a shape with a diameter in the channel-width direction smaller than that of the first contact and a diameter in the channel-length direction almost equal to that of the first contact when viewed from above the substrate. A wiring is electrically connected to the first transistor through the second contact. |
申请公布号 |
US9024444(B2) |
申请公布日期 |
2015.05.05 |
申请号 |
US201414297237 |
申请日期 |
2014.06.05 |
申请人 |
Kabushiki Kaisha Toshiba |
发明人 |
Abe Kenichi;Futatsuyama Takuya;Sato Jumpei |
分类号 |
H01L23/48 |
主分类号 |
H01L23/48 |
代理机构 |
Oblon, McClelland, Maier & Neustadt, L.L.P. |
代理人 |
Oblon, McClelland, Maier & Neustadt, L.L.P. |
主权项 |
1. A semiconductor device comprising:
a semiconductor substrate; a first well of a first conductivity type provided on the semiconductor substrate; a first transistor provided in the first well; a first contact diffusion layer provided in the first well so as to be electrically connected to the first well, the first contact diffusion layer extending in a channel width direction of the first transistor; a second contact diffusion layer provided in the first well so as to be electrically connected to the first well, the second contact diffusion layer extending in a channel length direction of the first transistor; a first contact provided on the first contact diffusion layer, the first contact having a shape with a diameter in the channel width direction larger than a diameter in the channel length direction when the first contact is viewed from above the semiconductor substrate; a second contact provided on the second contact diffusion layer, the second contact having a shape with a diameter in the channel width direction smaller than that of the first contact and a diameter in the channel length direction almost equal to that of the first contact when the second contact is viewed from above the semiconductor substrate; and a wiring electrically connected to at least a part of the first transistor through the second contact, wherein the second contact is not provided in the first contact diffusion layer. |
地址 |
Minato-ku JP |