Semiconductor device having conductive vias and semiconductor package having semiconductor device

摘要

The present invention relates to a package having a semiconductor device. The semiconductor device includes a substrate body, a plurality of conductive vias and a plurality of metal pads. The conductive vias are disposed in the through holes of the substrate body. The metal pads are electrically connected to the conductive vias. At least one of the metal pads has at least one curved side wall and at least one reference side wall. The curvature of the curved side wall is different from that of the reference side wall, so as to allow the metal pads to be closer to each other. This arrangement allows the conductive to be closer to each other. Therefore, more conductive vias can be arranged in a limited space.

主权项

1. A semiconductor substrate comprising a plurality of conductive vias, each of the conductive vias disposed in an insulated through hole and having a metal pad electrically connected thereto, wherein a first conductive via includes a first metal pad having a curved side wall and a reference side wall, a curvature of the curved side wall different from that of the reference side wall, and the curved side wall of the first metal pad defines a radius, the radius greater than a distance from a central axis of the first conductive via to a periphery of a second metal pad of an adjacent, second conductive via.