Embedded printed circuit board and method for manufacturing same

摘要

A method for manufacturing an embedded printed circuit board includes the following steps. First, a circuit substrate is provided. The circuit substrate includes a base, a first wiring layer, and a second wiring layer. The first wiring layer includes a number of electrode connection wires. Second, an opening is defined in the circuit substrate. The opening passes through the base and the second wiring layer. Third, an anisotropic conductive film is adhered onto the electrode connection wires in the opening. Fourth, an electrical element including many electrodes is provided. Fifth, the electrical element is arranged in the opening, with the electrodes respectively spatially correspond to the electrode connection wires, and each electrode is electrically connected to the corresponding electrode connection wire through the anisotropic conductive film, thereby obtaining an embedded printed circuit board.

主权项

1. An embedded printed circuit board, comprising:
a circuit substrate, the circuit substrate comprising a base, a first wiring layer, and a second wiring layer, the first wiring layer and the second wiring layer being respectively arranged at opposite surfaces of the base, the first wiring layer comprising a plurality of electrode connection wires, the circuit substrate defining an opening, the opening being spatially corresponding to the electrode connection wires, thereby exposing the electrode connection wires; an anisotropic conductive film received in the opening and adhered on the electrode connection wires; and an electrical element arranged in the opening of the circuit substrate, the electrical element comprising a plurality of electrodes, the electrodes respectively corresponding to the electrode connection wires, and each electrode being electrically connected to the corresponding electrode connection wire through the anisotropic conductive film.