Semiconductor light emitting device comprising cut-and-bent portions

摘要

Provided are a semiconductor light emitting module and a method of manufacturing the same, which allow achieving high luminance light emission as well as lightweight and compact features. In a semiconductor light emitting module (101), a projecting portion (202) serving as a reflecting member is formed on a metal thin plate (102) to surround a semiconductor light emitting element (104). The semiconductor light emitting element (104) is connected to a printed board (103) by using a wire (201), for example. The projecting portion (202) is formed by pressing and bending the metal thin plate (102) from a back surface, for example, to surround the element and to be higher than the semiconductor light emitting element (104).

主权项

1. A semiconductor light emitting device comprising:
a plurality of semiconductor light emitting modules; and a heat dissipation plate, wherein each semiconductor light emitting module includes a single board to which a plurality of plates are attached, wherein each plate disposes a semiconductor light emitting element in contact with a surface of the each plate; wherein the single board is electrically connected to each semiconductor light emitting element disposed on the each plate and supplies electric power to the each semiconductor light emitting element, wherein the single board covers a second portion within a first surface of the each plate excluding a first portion, the first portion being the semiconductor light emitting element and the neighborhood of the semiconductor lighting emitting element, and wherein a second surface of the each plate excluding the second portion is exposed; and wherein the heat dissipation plate includes cut-and-bent portions, the cut-and-bent portions being formed by incising parts of the heat dissipation plate to bend up edges of the parts of the heat dissipation plate, the cut-and-bent portions sandwich the exposed second surface of the each plate and a base surface of the each plate so that the base surface of the each plate closely contacts the heat dissipation plate.