发明名称 |
Clathrate, curing agent, cure accelerator, epoxy resin composition, and epoxy resin composition for encapsulation of semiconductor |
摘要 |
It is an object of the present invention to provide a clathrate that suppresses a curing reaction at low temperature to promote an improvement in storage stability (one-component stability), and can effectively cure a resin by heating treatment. A clathrate suitable for the clathrate is a clathrate containing (b1) at least one selected from the group consisting of an aliphatic polyvalent carboxylic acid, 5-nitroisophthalic acid, 5-tert-butylisophthalic acid, 5-hydroxyisophthalic acid, isophthalic acid, and benzophenone-4,4′-dicarboxylic acid; and (b2) at least one selected from the group consisting of an imidazole compound represented by the following formula (I), and 1,8-diazabicyclo[5.4.0]undecene-7, at a molar ratio of 1:1. |
申请公布号 |
US9023956(B2) |
申请公布日期 |
2015.05.05 |
申请号 |
US201013138654 |
申请日期 |
2010.03.15 |
申请人 |
Nippon Soda Co., Ltd. |
发明人 |
Kaneko Masami;Ono Kazuo |
分类号 |
C07D221/02;C07D233/56;C07D233/58;C07D233/60;C07D233/61;C07D233/64;C08G59/42;C08G59/68;H01L23/29;C07D233/54;C08G59/40;C08G59/70 |
主分类号 |
C07D221/02 |
代理机构 |
Foley & Lardner LLP |
代理人 |
Foley & Lardner LLP |
主权项 |
1. A clathrate containing:
(b1) at least one selected from the group consisting of 5-nitroisophthalic acid, 5-tert-butylisophthalic acid, and benzophenone-4,4′-dicarboxylic acid; and (b2) 1,8-diazabicyclo[5.4.0]undecene-7, at a molar ratio of 1:1. |
地址 |
Tokyo JP |