| 摘要 |
A miniature component includes an MMIC microwave chip encapsulated in an individual package for surface-mounting capable of operating at a frequency F0 very much higher than 45 GHz; and at least one contactless microwave port, by electromagnetic coupling, ensuring the transmission of coupling signals at a working frequency F0. The component comprises a passive multilayer integrated circuit having metallized layers and layers of dielectric material, a top face, a metallized bottom face, the metallized bottom face comprising, on the side of the contactless microwave port, an opening in the metallization for the passage of the coupling electromagnetic waves via the contactless microwave port and, between two layers of dielectric material, a metallized layer having at least one electromagnetic coupling electrical conductor connected to the electronic elements of the chip, said coupling electrical conductor being situated at the level of the contactless microwave port to ensure the transmission of microwave signals by electromagnetic coupling at the working frequency F0. |
