| 主权项 |
1. A substrate placing table for supporting a workpiece substrate in a substrate processing apparatus which performs a specified process with respect to the workpiece substrate, comprising:
a peripheral member installed in a corresponding relationship with a peripheral portion of the workpiece substrate and temperature-controlled to a first temperature; a central member installed in a corresponding relationship with a central portion of the workpiece substrate, the central member insulated from the peripheral member and temperature-controlled to a second temperature differing from the first temperature; a peripheral placing member installed above the peripheral member so as to make contact with the peripheral member and configured to support the peripheral portion of the workpiece substrate; and a central placing member installed above the central member so as to make contact with the central member and so as to be insulated from the peripheral placing member, the central placing member configured to support the central portion of the workpiece substrate, wherein the peripheral placing member and the central placing member are formed into shapes differing from the shapes of the peripheral member and the central member, respectively, so as to correspond to a processing distribution, the peripheral placing member is installed such that a portion of the peripheral placing member corresponding to the peripheral member makes contact with the peripheral member and a portion of the peripheral placing member protruding toward the central member is insulated from the central member, and the central placing member is installed such that a portion of the central placing member corresponding to the central member makes contact with the central member and a portion of the central placing member protruding toward the peripheral member is insulated from the peripheral member. |
