| 发明名称 |
FLEXIBLE PACKAGING FOR MICROELECTRONIC DEVICES |
| 摘要 |
An apparatus, method, and system, the apparatus and system including a flexible microsystems enabled microelectronic device package including a microelectronic device positioned on a substrate; an encapsulation layer encapsulating the microelectronic device and the substrate; a protective layer positioned around the encapsulating layer; and a reinforcing layer coupled to the protective layer, wherein the substrate, encapsulation layer, protective layer and reinforcing layer form a flexible and optically transparent package around the microelectronic device. The method including encapsulating a microelectronic device positioned on a substrate within an encapsulation layer; sealing the encapsulated microelectronic device within a protective layer; and coupling the protective layer to a reinforcing layer, wherein the substrate, encapsulation layer, protective layer and reinforcing layer form a flexible and optically transparent package around the microelectronic device. |
| 申请公布号 |
US2015114451(A1) |
申请公布日期 |
2015.04.30 |
| 申请号 |
US201314068189 |
申请日期 |
2013.10.31 |
| 申请人 |
Sandia Corporation |
发明人 |
Anderson Benjamin John;Nielson Gregory N.;Cruz-Campa Jose Luis;Okandan Murat;Lentine Anthony L.;Resnick Paul J. |
| 分类号 |
H01L31/0203;H01L31/048;H01L31/18 |
主分类号 |
H01L31/0203 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A flexible microsystems enabled microelectronic device package comprising:
a microelectronic device positioned on a substrate; an encapsulation layer encapsulating the microelectronic device and the substrate; a protective layer positioned around the encapsulating layer; and a reinforcing layer coupled to the protective layer, wherein the substrate, encapsulation layer, protective layer and reinforcing layer form a flexible package around the microelectronic device. |
| 地址 |
Albuquerque NM US |
