SEMICONDUCTOR PACKAGE HAVING MAGNETIC CONNECTION MEMBER

摘要

Provided is a semiconductor package including a wiring substrate having top and bottom surfaces facing each other. A first semiconductor chip is disposed on the wiring substrate in a flip-chip manner. The first semiconductor chip has a first surface facing the top surface of the wiring substrate and a second surface opposite to the first surface. First connection members are disposed between the wiring substrate and the first semiconductor chip. The first connection members include first and second contact members each including one or more magnetic materials. The first contact members include portions disposed in the second contact members. The one or more magnetic material of the first contact members have an opposite polar orientation to that of the second contact members.

主权项

1. A semiconductor package, comprising:
a wiring substrate having top and bottom surfaces facing each other; a first semiconductor chip disposed on the wiring substrate in a flip-chip manner, the first semiconductor chip having a first surface facing the top surface of the wiring substrate and a second surface opposite to the first surface; and first connection members disposed between the wiring substrate and the first semiconductor chip, the first connection members comprising first and second contact members each including one or more magnetic materials, wherein the first contact members comprise portions disposed in the second contact members, and the one or more magnetic materials of the first contact members have an opposite polar orientation to the one or more magnetic materials of the second contact members.