| 发明名称 |
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME |
| 摘要 |
A semiconductor device includes: a block module which internally includes a power semiconductor element and a first heatsink, and from which a main circuit terminal and a control terminal are drawn; a control substrate connected to the control terminal; a package in which the block module and the control substrate are housed; and a second heatsink to which the package is fixed by a connection screw. The connection screw is inserted into the second heatsink so as to be inclined at an inclination angle θ relative to a normal to a surface of the second heatsink. |
| 申请公布号 |
US2015116945(A1) |
申请公布日期 |
2015.04.30 |
| 申请号 |
US201314395411 |
申请日期 |
2013.04.26 |
| 申请人 |
Panasonic Intellectual Property Management Co., Ltd. |
发明人 |
Minamio Masanori |
| 分类号 |
H05K7/20;H01L21/02 |
主分类号 |
H05K7/20 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A semiconductor device comprising:
a block module which internally includes a power semiconductor element and a first heatsink, and from which a main circuit terminal and a control terminal are drawn; a control substrate connected to the control terminal; a package in which the block module and the control substrate are housed; and a second heatsink to which the package is fixed by a connection screw, wherein the connection screw is inserted into the second heatsink so as to be inclined at an inclination angle θ relative to a normal to a surface of the second heatsink. |
| 地址 |
Osaka JP |
