发明名称 半導体装置とその製造方法
摘要 A semiconductor device includes a first compound semiconductor layer, a second compound semiconductor layer having a larger band gap than that of the first compound semiconductor layer, a p-type third compound semiconductor layer disposed above a portion of the second compound semiconductor layer, a p-type fourth compound semiconductor layer disposed above the third compound semiconductor layer and having a higher resistance than that of the third compound semiconductor layer, and a gate electrode disposed above the fourth compound semiconductor layer.
申请公布号 JP5707463(B2) 申请公布日期 2015.04.30
申请号 JP20130204162 申请日期 2013.09.30
申请人 株式会社豊田中央研究所;トヨタ自動車株式会社 发明人 兼近 将一;桑原 誠;上田 博之;富田 英幹
分类号 H01L21/337;H01L21/338;H01L27/098;H01L29/778;H01L29/808;H01L29/812 主分类号 H01L21/337
代理机构 代理人
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