| 发明名称 |
CORE SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME |
| 摘要 |
Disclosed herein are a core substrate and a method for manufacturing the same. According to a preferred embodiment of the present invention, a core substrate includes: a porous scaffold formed with a void; an insulating material formed to fill a void of the porous scaffold; and an electronic device embedded into the porous scaffold and the insulating material and having external electrodes formed on both surfaces thereof. |
| 申请公布号 |
US2015114696(A1) |
申请公布日期 |
2015.04.30 |
| 申请号 |
US201414525062 |
申请日期 |
2014.10.27 |
| 申请人 |
Samsung Electro-Mechanics Co., Ltd. |
发明人 |
Hong Jin Ho;Lee Keun Yong;Kim Sung Han;Lee Sa Yong;Shin Sang Hyun |
| 分类号 |
H05K1/18;H01G4/12;H05K3/40;H05K1/11;H05K3/00;H05K3/44;H01G4/30;H05K1/03 |
主分类号 |
H05K1/18 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A core substrate, comprising:
a porous scaffold formed with a void; an insulating material formed to fill a void of the porous scaffold; and an electronic device embedded into the porous scaffold and the insulating material and having external electrodes formed on both surfaces thereof. |
| 地址 |
Suwon-Si KR |
