摘要 |
A positive temperature coefficient heating assembly includes a heating core (10) including a first metal electrode plate (2a), a second metal electrode plate (2b) and a plurality of PTC ceramic chips (1); an insulating layer coated on the heating core (10); and a metal tube (8); the PTC ceramic chip (1) includes a positive electrode layer, a negative electrode layer, and a ceramic sintered layer; a plurality of first limit grooves (21a) are formed in the first metal electrode plate (2a), a plurality of second limit grooves (2b) are formed in the second metal electrode plate (21b), a first end of each of the PTC ceramic chips (1) is embedded in one of the first limit grooves (21a), and a second end of each of the PTC ceramic chips (1) is embedded in one of the second limit grooves (21b). |
申请人 |
BYD COMPANY LIMITED |
发明人 |
GONG, QING;LIN, XINPING;WU, HUI;LI, XIAOFANG;REN, MAOLIN;WANG, SHUMIN;WU, MENGXIANG;DENG, TIANYOU;WEN, HUAITONG;ZHANG, WEIFENG;QIU, HONGMEI |