发明名称 |
ACTIVE ESTER RESIN, THERMOSETTING RESIN COMPOSITION, CURED PRODUCT OF SAME, SEMICONDUCTOR ENCAPSULATION MATERIAL, PREPREG, CIRCUIT BOARD, AND BUILD-UP FILM |
摘要 |
A cured product exhibits good heat resistance and flame retardancy as well as low dielectric constant and low loss tangent. A phosphorus-containing compound (i) obtained by a reaction between an aromatic aldehyde (a1) having an alkoxy group as a substituent on a nucleus and an organic phosphorus compound (a2) having a P—H group or a P—OH group in a molecular structure is reacted with a phenolic substance (a3) to obtain a phosphorus-containing phenolic substance (A1). Then the phosphorus-containing phenolic substance (A1) is reacted with an aromatic dicarboxylic acid or an anhydride or dihalide of an aromatic dicarboxylic acid or a C2-6 saturated dicarboxylic acid or an anhydride or dihalide of a C2-6 saturated dicarboxylic acid (A2) so that all or some of hydroxyl groups of the phenolic substance (A1) form ester bonds. |
申请公布号 |
US2015118499(A1) |
申请公布日期 |
2015.04.30 |
申请号 |
US201314386476 |
申请日期 |
2013.03.19 |
申请人 |
DIC Corporation |
发明人 |
Suzuki Etsuko;Arita Kazuo |
分类号 |
C08G8/32;H05K1/05;H05K3/00;C08L61/14 |
主分类号 |
C08G8/32 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
Tokyo JP |