发明名称 SEMICONDUCTOR STRUCTURE
摘要 <p>A semiconductor structure includes a carrier, a first protective layer, a second protective layer, and a third protective layer. A first surface of the first protective layer comprises a first anti-stress zone. A first extension line from a first bottom edge intersects with a second extension line from a second bottom edge to form a first base point. A first projection line is formed on the first surface, an extension line of the first projection line intersects with the second bottom edge to form a first intersection point, a second projection line is formed on the first surface, and an extension line of the second projection line intersects with the first bottom edge to form a second intersection point. A zone by connecting the first base point, the first intersection point and the second intersection point is the first anti-stress zone.</p>
申请公布号 SG10201404290Y(A) 申请公布日期 2015.04.29
申请号 SG10201404290Y 申请日期 2014.07.22
申请人 CHIPBOND TECHNOLOGY CORPORATION 发明人 CHIN-TANG HSIEH;YOU-MING HSU;MING-SHENG LIU;CHIH-PING WANG
分类号 H01L23/31 主分类号 H01L23/31
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