ELECTROMAGNETIC SHIELDING FILM AND METHOD OF COVERING ELECTRONIC COMPONENT

摘要

This EM-shielding film is used to cover convexities on a substrate and comprises a base layer and an EM-blocking layer laminated to one surface of said base layer. The base layer is designed so as to exhibit a storage elastic modulus of 2.0×105 to 5.0×108 Pa at 150°C. The present invention provides an EM-shielding film that increases the degree of freedom available when designing a substrate, allows reductions in weight and thickness, and exhibits good shape-following performance with respect to electronic components that have convexities with sizes greater than or equal to 500 µm. The present invention also provides a method wherein said EM-shielding film is used to cover an electronic component.