发明名称 |
RESIN COMPOSITION FOR PRINTED WIRING BOARDS |
摘要 |
Provided is a resin composition which enables the formation of a roughened surface having a low roughness degree on the surface of an insulation layer in a printed wiring board material when used on the insulation layer regardless of the roughening conditions employed and also enables the formation of a conductive layer having excellent adhesion properties, heat resistance, heat resistance under absorption of moisture, thermal expansion properties and chemical resistance on the roughened surface. A resin composition comprising (A) an inorganic filler that is soluble in an acid, (B) a cyanic acid ester compound and (C) an epoxy resin. |
申请公布号 |
EP2733177(A4) |
申请公布日期 |
2015.04.29 |
申请号 |
EP20120811367 |
申请日期 |
2012.07.03 |
申请人 |
MITSUBISHI GAS CHEMICAL COMPANY, INC. |
发明人 |
KASHIMA, NAOKI;HASEBE, KEIICHI;SHIKA, SEIJI;MABUCHI, YOSHINORI;KATO, YOSHIHIRO |
分类号 |
C08L63/00;C08G59/40;C08J5/24;C08K3/00;C08K5/3415;C08L65/00;H05K1/03 |
主分类号 |
C08L63/00 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|