Formation of conductive circuit, conductive circuit, and conductive ink composition

摘要

A conductive circuit is formed by printing a pattern of an ink composition and curing the pattern. The ink composition is a substantially solvent-free, liquid, addition curable, ink composition comprising (A) an organopolysiloxane having at least two alkenyl groups, (B) an organohydrogenpolysiloxane having at least two SiH groups, (C) conductive particles having an average particle size ≧5 μm, (D) conductive micro-particles having an average particle size <5 μm, (E) a thixotropic agent, and (F) a hydrosilylation catalyst.

主权项

1. A method for forming a conductive circuit comprising the steps of printing a pattern using a conductive ink composition and curing the pattern into a conductive circuit,
said conductive ink composition being a substantially solvent-free, liquid, addition curable, conductive circuit-forming ink composition comprising (A) an organopolysiloxane having at least two silicon-bonded alkenyl groups, (B) an organohydrogenpolysiloxane having at least two silicon-bonded hydrogen atoms, (C) conductive particles having an average particle size of at least 5 μm, selected from the group consisting of metal particles, gold-plated particles, silver-plated particles, and copper-plated particles, (D) conductive micro-particles having an average particle size of less than 5 μm, selected from the group consisting of metal particles, gold-plated particles, silver-plated particles, and copper-plated particles, component (D) being present in an amount of at least 1 part by volume per 100 parts by volume of component (A), (E) a thixotropic agent, and (F) a hydrosilylation catalyst.