Stacked packages using laser direct structuring

摘要

Described herein is a stacked package using laser direct structuring. The stacked package includes a die attached to a substrate. The die is encapsulated with a laser direct structuring mold material. The laser direct structuring mold material is laser activated to form circuit traces on the top and side surfaces of the laser direct structuring mold material. The circuit traces then undergo metallization. A package is then attached to the metalized circuit traces and is electrically connected to the substrate via the metalized circuit traces.

主权项

1. A laser direct structuring (LDS) stacked package, comprising:
a substrate; a LDS mold material covered die attached to the substrate, wherein at least one surface of the LDS mold material has metalized circuit traces; and a package attached to the metalized circuit traces.