发明名称 Techniques for providing a semiconductor memory device
摘要 Techniques for providing a semiconductor memory device are disclosed. In one particular exemplary embodiment, the techniques may be realized as a semiconductor memory device including a plurality of memory cells arranged in an array of rows and columns. Each memory cell including a first region, a second region, and a body region capacitively coupled to at least one word line and disposed between the first region and the second region. Each memory cell also including a third region, wherein the third region may be doped differently than the first region, the second region, and the body region.
申请公布号 US9019759(B2) 申请公布日期 2015.04.28
申请号 US201314043833 申请日期 2013.10.01
申请人 Micron Technology, Inc. 发明人 Banna Srinivasa R.;Van Buskirk Michael A.;Thurgate Timothy
分类号 G11C11/34;G11C7/00;H01L27/105;H01L27/12;H01L29/78;H01L27/108 主分类号 G11C11/34
代理机构 Wilmer Cutler Pickering Hale and Dorr LLP 代理人 Wilmer Cutler Pickering Hale and Dorr LLP
主权项 1. A method for biasing a semiconductor memory device comprising the steps of: applying a first voltage potential to a first region of a first memory cell in an array of memory cells via a respective source line of the array; applying a second voltage potential to a second region of the first memory cell via a respective bit line of the array; applying a third voltage potential to a body region of the first memory cell via at least one respective word line of the array that is capacitively coupled to the body region; and applying a fourth voltage potential to a third region of the first memory cell via a respective carrier injection line of the array; wherein the first region, the second region, and the body region have a common first doping polarity.
地址 Boise ID US