Semiconductor package substrate and semiconductor package including the same

摘要

A semiconductor package substrate including a substrate body having a front surface configured for mounting a semiconductor chip on the front surface and a rear surface facing the front surface and comprising a window passing through the front and rear surfaces, the window having one or more surfaces inclined from the front surface toward the rear surface; and a conductive pattern arranged along an inclined surface of the window so as to extend from the front surface to the rear surface of the substrate body.

主权项

1. A semiconductor package comprising:
a package substrate comprising a substrate body having a front surface on which the semiconductor chip is mounted and a rear surface facing the front surface and comprising a window passing through the front and rear surfaces, the window having one or more surfaces inclined from the front surface toward the rear surface; and a conductive pattern arranged along an inclined surface of the window so as to extend from the front surface to the rear surface of the substrate body; a semiconductor chip having a plurality of bump electrically coupled to the package substrate, wherein the semiconductor chip and the package substrate are coupled to each other through the bump of the semiconductor chip and the conductive patterns of the package substrate.