发明名称 |
Method for fabricating a chip having a water-repellent obverse surface and a hydrophilic reverse surface |
摘要 |
In order to provide a novel method for producing a chip having a water-repellent obverse surface and a hydrophilic reverse surface, the characteristic of the present disclosure lies in that the obverse surface of the chip having a hydroxyl group is brought into contact with an organic solvent in which R1—Si(OR2)3 or R1—SiY3 is dissolved in a second hydrophobic solvent, while the reverse surface of the chip is protected by the water film, so as to form a water-repellent film on the obverse surface of the chip. |
申请公布号 |
US9018042(B2) |
申请公布日期 |
2015.04.28 |
申请号 |
US201314090198 |
申请日期 |
2013.11.26 |
申请人 |
Panasonic Intellectual Property Management Co., Ltd. |
发明人 |
Arase Hidekazu;Komori Tomoyuki |
分类号 |
H01L23/00;H01L23/31;H01L21/56;H01L21/683 |
主分类号 |
H01L23/00 |
代理机构 |
Wenderoth, Lind & Ponack, L.L.P. |
代理人 |
Wenderoth, Lind & Ponack, L.L.P. |
主权项 |
1. A method for fabricating a chip having a water-repellent obverse surface and a hydrophilic reverse surface, the method comprising:
(a) preparing a first substrate comprising the chip on the reverse surface thereof through a wax film; wherein the chip comprises an obverse surface and a reverse surface; the obverse surface of the chip is in contact with the wax film 830; the reverse surface of the chip is hydrophilic; (b) bringing the reverse surface of the chip into contact with a second substrate having a water film on the obverse surface thereof to obtain a laminate composed of the first substrate and the second substrate; wherein the reverse surface of the chip is brought into contact with the water film; (c) immersing the laminate in a first hydrophobic solvent to dissolve the wax film in the first hydrophobic solvent; (d) removing the first substrate to obtain the second substrate where the chip is attached on the obverse surface thereof; wherein the reverse surface of the chip is in contact with the water film; and the obverse surface of the chip is exposed; (e) bringing the obverse surface of the chip having a hydroxyl group into contact with an organic solvent in which R1—Si(OR2)3 or R1—SiY3 is dissolved in a second hydrophobic solvent, while the reverse surface of the chip is protected by the water film, so as to form a water-repellent film on the obverse surface of the chip; wherein R1 represents a hydrocarbon group or a fluorinated hydrocarbon group; R2 represents an alkoxy group; and Y represents halogen; and (f) removing the second substrate to obtain the chip having the water-repellent obverse surface and the hydrophilic reverse surface. |
地址 |
Osaka JP |